Organic light-emitting display device having an upper substrate formed by a metal and method of fabricating the same

ABSTRACT

An organic light-emitting display device is provided. The organic light-emitting display device includes an upper substrate coupling a lower substrate by an encapsulating layer. The upper substrate includes a metal. An inclined surface is formed at an edge of a substrate of the upper substrate by a rotating polishing wheel. Thus, in the organic light-emitting display device, the reliability may be prevented from being decreased by the metal burr without lowering the process efficiency and uniformity.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Korean PatentApplication No. 10-2017-0063016, filed on May 22, 2017, which is herebyincorporated by reference in its entirety as if fully set forth herein.

BACKGROUND Field of the Disclosure

The present disclosure relates to an organic light-emitting displaydevice comprising an upper substrate including a metal, and a lowersubstrate coupled to the upper substrate by an encapsulating layercovering a light-emitting structure, and a method of fabricating thesame.

Description of the Background

Generally, an electronic appliance, such as a monitor, a TV, a laptopcomputer, and a digital camera, includes a display device to realize animage. For example, the display device may include a liquid crystaldisplay device and/or an organic light-emitting display device.

The organic light-emitting display device may include a display panel, agate driver applying a gate signal to the display panel, and a datadriver applying a data signal to the display panel. The display panelmay include a lower substrate and an upper substrate attached to thelower substrate. A light-emitting structure may be disposed between thelower substrate and the upper substrate. For example, the display panelmay further include an encapsulating layer covering the light-emittingstructure. A space between the lower substrate and the upper substratemay be filled by the encapsulating layer.

The gate driver and/or the data driver may be electrically connected tothe display panel by a flexible printed circuit board (FPCB). Forexample, the gate driver and/or the data driver may include a drive ICmounted on the FPCB. The FPCB may be electrically connected to thelight-emitting structure by a pad on the lower substrate. The FPCB mayextend onto an upper surface of the upper substrate opposite to thelower substrate.

The organic light-emitting display device may include the uppersubstrate formed of metal. For example, a method of fabricating theorganic light-emitting display device may include forming the uppersubstrate by a laser cutting process. When the upper substrate is formedby the laser cutting process, a metal burr may be formed at an edge of asurface of the upper substrate. Thus, in the organic light-emittingdisplay device, a moisture-permeating path may be provided due to aninsulating layer damaged by the metal burr, or a signal applied to thedisplay panel may be distorted or interrupted due to the FPCB damaged bythe metal burr.

In order to solve the problem caused by the metal burr, the method offabricating the organic light-emitting display device may includepolishing the surface of the upper substrate formed by the laser cuttingprocess using a polishing unit. However, since the metal burr cannot becompletely removed only by a surface polishing process, the method offabricating the organic light-emitting display device further requiresinspecting the surface of the upper substrate, and additional polishingthe surface of the upper substrate individually. Thus, in the organiclight-emitting display device, the process efficiency can be decreasedand the uniformity can be lowered due to change the shape of the surfaceof the upper substrate depending on whether the substrate is furtherpolished or not.

SUMMARY

Accordingly, the present disclosure is directed to a display device thatsubstantially obviates one or more problems due to limitations anddisadvantages of the related art.

More specifically, the present disclosure is to provide an organiclight-emitting display device in which the reliability can be preventedfrom being decreased by the metal burr without lowering the processefficiency and uniformity.

In addition, the present disclosure is to provide a display device inwhich the metal burr may be completely removed by a single process.

Additional advantages and features of the disclosure will be set forthin part in the description which follows and in part will becomeapparent to those having ordinary skill in the art upon examination ofthe following or may be learned from practice of the disclosure. Otheradvantages of the disclosure may be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the disclosure, as embodied and broadly described herein, there isprovided an organic light-emitting display device including an uppersubstrate on a lower substrate. The upper substrate includes a metal. Anencapsulating layer is disposed between the lower substrate and theupper substrate. The upper substrate includes a side inclined surface.The side inclined surface of the upper substrate is located between anupper surface of the upper substrate opposite to the encapsulating layerand a side surface of the upper substrate. The side inclined surface isa concavo-convex shape.

The side inclined surface of the upper substrate may overlap the lowersubstrate in the outside of the encapsulating layer.

The concavo-convex shape of the side inclined surface may extend in adirection.

The concavo-convex shape of the side inclined surface may extend alongthe side surface of the upper substrate.

A pad may be disposed on the lower substrate exposed by theencapsulating layer. The pad may be connected to a flexible printedcircuit board (FPCB). The FPCB may extend onto the upper surface of theupper substrate. The FPCB may include a first FPCB insulating layer, aFPCB conductive layer and a second FPCB insulating layer, which aresequentially stacked. The first FPCB insulating layer may be locatedclose to the upper substrate. A thickness of the first FPCB insulatinglayer may be larger than a height of the concavo-convex shape of theside inclined surface.

The thickness of the first FPCB insulating layer may be a value betweena thickness of the FPCB conductive layer and a thickness of the secondFPCB insulating layer.

A corner inclined surface may be disposed at a corner of the uppersurface of the upper substrate. A length of the corner inclined surfacemay be longer than a length of the side inclined surface.

The corner inclined surface of the upper substrate may overlap with thelower substrate in the outside of the encapsulating layer.

A vertical distance between a lower surface of the upper substrate andthe corner inclined surface may be equal to a vertical distance betweenthe lower surface of the upper substrate and the side inclined surface.

A height of the corner inclined surface may be equal to a height of theside inclined surface.

A method of fabricating the organic light-emitting display deviceincludes forming an upper mother substrate using a metal, forming anupper substrate by cutting the upper mother substrate using a laser,forming an inclined surface at an edge of a surface of the uppersubstrate by a rotating polishing wheel, and coupling the uppersubstrate in which the inclined surface is formed to a lower substratein which a light-emitting structure is formed. Forming the uppersubstrate to the lower substrate includes locating the upper substrateon the lower substrate such that the inclined surface of the uppersubstrate faces the lower substrate.

An encapsulating layer may be formed on the upper mother substrate.Forming the upper substrate may include cutting the encapsulating layerby the laser. Forming the inclined surface may include polishing theedge of the surface of the upper substrate opposite to the encapsulatinglayer using the polishing wheel.

Forming the inclined surface may include locating the upper substrateabove the polishing wheel, and polishing the edge of the surface of theupper substrate facing the polishing wheel by the polishing wheel.

Forming the inclined surface may include polishing the edge of the uppersubstrate using a side surface of the polishing wheel.

The upper substrate in which the inclined surface is formed may becleaned before coupling the upper substrate to the lower substrate.Cleaning the upper substrate may include moving particles which isdisposed on the surface of the upper substrate to the outside of theupper substrate by a brush.

The polishing wheel may be formed of diamond.

The inclined surface of the upper substrate may be formed in aconcavo-convex shape.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this application, illustrate aspect(s) of the disclosure andtogether with the description serve to explain the principle of thedisclosure.

In the drawings:

FIG. 1 is a view schematically showing an organic light-emitting displaydevice according to an aspect of the present disclosure;

FIG. 2A is a view taken along I-I′ of FIG. 1;

FIG. 2B is an enlarged view of region P in FIG. 2A;

FIG. 2C is an enlarged view of region R in FIG. 2A;

FIG. 2D is a view showing a side inclined surface illustrated in FIG.2A;

FIG. 3 is a view taken along II-II′ of FIG. 1;

FIG. 4 is a view showing a side inclined surface of an organiclight-emitting display device according to another aspect of the presentdisclosure; and

FIGS. 5A to 5D are views sequentially showing a method of fabricatingthe organic light-emitting display device according to an aspect of thepresent disclosure.

DETAILED DESCRIPTION

Hereinafter, details related to the above objects, technicalconfigurations, and operational effects of the aspects of the presentdisclosure will be clearly understood by the following detaileddescription with reference to the drawings, which illustrate someaspects of the present disclosure. Here, the aspects of the presentdisclosure are provided in order to allow the technical sprit of thepresent disclosure to be satisfactorily transferred to those skilled inthe art, and thus the present disclosure may be embodied in other formsand is not limited to the aspects described below.

In addition, the same or extremely similar elements may be designated bythe same reference numerals throughout the specification, and in thedrawings, the lengths and thickness of layers and regions may beexaggerated for convenience. It will be understood that, when a firstelement is referred to as being “on” a second element, although thefirst element may be disposed on the second element so as to come intocontact with the second element, a third element may be interposedbetween the first element and the second element.

Here, terms such as, for example, “first” and “second” may be used todistinguish any one element with another element. However, the firstelement and the second element may be arbitrary named according to theconvenience of those skilled in the art without departing the technicalsprit of the present disclosure.

The terms used in the specification of the present disclosure are merelyused in order to describe particular aspects, and are not intended tolimit the scope of the present disclosure. For example, an elementdescribed in the singular form is intended to include a plurality ofelements unless the context clearly indicates otherwise. In addition, inthe specification of the present disclosure, it will be furtherunderstood that the terms “comprises” and “includes” specify thepresence of stated features, integers, steps, operations, elements,components, and/or combinations thereof, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or combinations.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example aspects belong. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andshould not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

FIG. 1 is a view schematically showing an organic light-emitting displaydevice according to an aspect of the present disclosure. FIG. 2A is aview taken along I-I′ of FIG. 1. FIG. 2B is an enlarged view of region Pin FIG. 2A. FIG. 2C is an enlarged view of region R in FIG. 2A. FIG. 2Dis a view showing a side inclined surface illustrated in FIG. 2A. FIG. 3is a view taken along II-IP of FIG. 1.

Referring to FIGS. 1, 2A to 2D and 3, the organic light-emitting displaydevice according to an aspect of the present disclosure may include adisplay panel 100. The display panel 100 may include a lower substrate110 and an upper substrate 120. The lower substrate 110 may include aninsulating material. The lower substrate 110 may include a transparentmaterial. For example, the lower substrate 110 may include glass orplastic. The upper substrate 120 may include a material different fromthe lower substrate 110. For example, the upper substrate 120 mayinclude a material having a predetermined strength. The upper substrate120 may include a material having a high reflectance. For example, theupper substrate 120 may include a metal such as aluminum (Al) and copper(Cu).

A size of the upper substrate 120 may be smaller than a size of thelower substrate 110. For example, the upper substrate 120 may include aside surface located on an upper surface of the lower substrate 110facing the upper substrate 120. At least one pad 105 may be located on aregion of the upper surface of the lower substrate 110 which does notoverlap the upper substrate 120.

The upper substrate 120 may include an inclined surface 120 cc (shown inFIG. 3) and 121 sc (shown in FIG. 2A) at an edge of an upper surface ofthe upper substrate 120 which is opposite to the lower substrate 110.For example, the upper substrate 120 may include a side inclined surface121 sc located between the upper surface and a side surface of the uppersubstrate 120, and a corner inclined surface 120 cc located at a cornerof the upper surface of the upper substrate 120.

A vertical distance h1 between a lower surface of the upper substrate120 facing the lower substrate 110 and the side inclined surface 121 scmay be equal to a vertical distance h2 between the lower surface of theupper substrate 120 and the corner inclined surface 120 cc. For example,the vertical height of the side inclined surface 121 sc may be equal tothe vertical height of the corner inclined surface 120 cc.

A length of the corner inclined surface 120 cc may be longer than alength of the side inclined surface 121 sc. For example, a horizontaldistance d1 of the side inclined surface 121 sc may be shorter than ahorizontal distance d2 of the corner inclined surface 120 cc. Theinclination angle of the side inclined surface 121 sc with respect tothe lower surface of the upper substrate 120 may the inclination angleof the corner inclined surface 120 cc with respect to the lower surfaceof the upper substrate 120.

The side inclined surface 121 sc and the corner inclined surface 120 ccof the upper substrate 120 may be a concavo-convex shape. For example,the side inclined surface 121 sc and the corner inclined surface 120 ccmay extend along the side surface of the upper substrate 120. The sideinclined surface 121 sc and the corner inclined surface 120 cc mayinclude a concave region and a convex region which are repeated in adirection perpendicular to the side surface of the upper substrate 120.

As shown in FIG. 2B, a thin film transistor 130, a light-emittingstructure 150 and an encapsulating layer 180 may be disposed between thelower substrate 110 and the upper substrate 120.

The thin film transistor 130 may be located in close proximity to thelower substrate 110. For example, the thin film transistor 130 may bedisposed between the lower substrate 110 and the light-emittingstructure 150. The thin film transistor 130 may include a semiconductorpattern 131, a gate insulating layer 132, a gate electrode 133, aninterlayer insulating layer 134, a source electrode 135 and a drainelectrode 136.

The semiconductor pattern 131 may include a semiconductor material. Forexample, the semiconductor pattern 131 may include amorphous silicon orpoly-crystalline silicon. The semiconductor pattern 131 may include anoxide semiconductor material. For example, the semiconductor pattern 131may include IGZO.

The semiconductor pattern 131 may include a source region, a drainregion and a channel region. The channel region may be disposed betweenthe source region and the drain region. The conductivity of the channelregion may be lower than the conductivities of the source region and thedrain region. For example, the source region and the drain region mayinclude a conductive impurity.

The gate insulating layer 132 may be located on the semiconductorpattern 131. A size of the gate insulating layer 132 may be smaller thana size of the semiconductor pattern 131. For example, the gateinsulating layer 132 may overlap with the channel region of thesemiconductor pattern 131.

The gate insulating layer 132 may include an insulating material. Forexample, the gate insulating layer 132 may include silicon oxide and/orsilicon nitride. The gate insulating layer 132 may include a high-Kmaterial. For example, the gate insulating layer 132 may include hafniumoxide (HfO) or titanium oxide (TiO). The gate insulating layer 132 maybe a multi-layer structure.

The gate electrode 133 may be disposed on the gate insulating layer 132.The gate insulating layer 132 may insulate the gate electrode 133 fromthe semiconductor pattern 131. The gate electrode 133 may overlap thechannel region of the semiconductor pattern 131. For example, a sidesurface of the gate insulating layer 132 may be vertically aligned witha side surface of the gate electrode 133. The gate insulating layer 132may have a side surface being continuous with the side surface of thegate electrode 133.

The gate electrode 133 may include a conductive material. For example,the gate electrode 133 may include a metal such as aluminum (Al), chrome(Cr), molybdenum (Mo) and tungsten (W).

The interlayer insulating layer 134 may be located on the semiconductorpattern 131 and the gate electrode 133. The interlayer insulating layer134 may extend beyond the semiconductor pattern 131. For example, a sidesurface of the semiconductor pattern 131 may be covered by theinterlayer insulating layer 134.

The interlayer insulating layer 134 may include an insulating material.For example, the interlayer insulating layer 134 may include siliconoxide and/or silicon nitride. The interlayer insulating layer 134 mayhave a multi-layer structure.

The source electrode 135 may be disposed on the interlayer insulatinglayer 134. For example, the source electrode 135 may overlap with thesource region of the semiconductor pattern 131. The source electrode 135may be electrically connected to the source region of the semiconductorpattern 131. For example, the interlayer insulating layer 134 mayinclude a contact hole exposing the source region of the semiconductorpattern 131.

The source electrode 135 may include a conductive material. For example,the source electrode 135 may include a metal such as aluminum (Al),chrome (Cr), molybdenum (Mo) and tungsten (W). The source electrode 135may include a material different from the gate electrode 133.

The drain electrode 136 may be disposed on the interlayer insulatinglayer 134. For example, the drain electrode 136 may overlap the drainregion of the semiconductor pattern 131. The drain electrode 136 may beseparated from the source electrode 135. The drain electrode 136 may beelectrically connected to the drain region of the semiconductor pattern131. For example, the interlayer insulating layer 134 may include acontact hole exposing the drain region of the semiconductor pattern 131.

The drain electrode 136 may include a conductive material. For example,the drain electrode 136 may include a metal such as aluminum (Al),chrome (Cr), molybdenum (Mo) and tungsten (W). The drain electrode 136may include a material different from the gate electrode 133. Forexample, the drain electrode 136 may include a material same as thesource electrode 135.

The organic light-emitting display device according to an aspect of thepresent disclosure is described that the semiconductor pattern 131 maybe in direct contact with the lower substrate 110. However, the organiclight-emitting display device according to another aspect of the presentdisclosure may include a buffer layer between the lower substrate 110and the thin film transistor 130. The buffer layer may include aninsulating material. For example, the buffer layer may include siliconoxide or silicon nitride.

The organic light-emitting display device according to an aspect of thepresent disclosure is described that the semiconductor pattern 131 islocated in close proximity to the lower substrate 110. However, in theorganic light-emitting display device according to another aspect of thepresent disclosure, the semiconductor pattern 131 of the thin filmtransistor 130 may be located between the gate electrode 133 and thesource/drain electrodes 135 and 136.

An over-coat layer 140 may be disposed on the thin film transistor 130and the upper substrate 120. The thin film transistor 130 may be coveredby the over-coat layer 140. The over-coat layer 140 may remove athickness difference due to the thin film transistor 130. For example,an upper surface of the over-coat layer 140 facing the upper substrate120 may be a flat surface. The upper surface of the over-coat layer 140may be parallel with the upper surface of the lower substrate 110. Theover-coat layer 140 may include an insulating material. For example, theover-coat layer 140 may include an organic material.

The organic light-emitting display device according to an aspect of thepresent disclosure is described that the over-coat layer 140 is indirect contact with the thin film transistor 130. However, the organiclight-emitting display device according to another aspect of the presentdisclosure may include a lower passivation layer disposed between thethin film transistor 130 and the over-coat layer 140. The lowerpassivation layer may include a material different from the over-coatlayer 140. For example, the lower passivation layer may include aninorganic material.

The light-emitting structure 150 may generate light realizing a specificcolor. For example, the light-emitting structure 150 may include a lowerlight-emitting electrode 151, a light-emitting layer 152 and an upperlight-emitting electrode 153, which are sequentially stacked. Thelight-emitting structure 150 may be disposed between the over-coat layer140 and the upper substrate 120. The light-emitting structure 150 may becontrolled by the thin film transistor 130. For example, the lowerlight-emitting electrode 151 of the light-emitting structure 150 may beelectrically connected to the drain electrode 136 of the thin filmtransistor 130. The over-coat layer 140 may include a contact holeexposing the drain electrode 136 of the thin film transistor 130.

The lower light-emitting electrode 151 may include a conductivematerial. The lower-light-emitting electrode 151 may include atransparent material. For example, the lower light-emitting layer 151may include ITO or IZO.

In the organic light-emitting display device according to an aspect ofthe present disclosure, the lower light-emitting electrode 151 of eachlight-emitting structure 150 may be separated from the lowerlight-emitting electrode 151 of adjacent light-emitting structure 150.For example, the organic light-emitting display device according to theaspect of the present disclosure may include a bank insulating layer 160separating between the lower light-emitting electrodes 151 of theadjacent light-emitting structures 150. The bank insulating layer 160may cover an edge of each lower light-emitting electrode 151. The bankinsulating layer 160 may include an insulating material. For example,the bank insulating layer 160 may include an organic material.

The light-emitting layer 152 may generate light having luminancecorresponding to a voltage difference between the lower light-emittingelectrode 151 and the upper light-emitting electrode 153. The lightgenerated by the light-emitting layer 152 may realize a specific color.For example, the light-emitting layer 152 may generate the lightrealizing one of red color, green color, blue color and white color.Each of the light-emitting structures 150 may realize a color differentfrom the adjacent light-emitting structure 150. For example, thelight-emitting layer 152 of each light-emitting structure 150 may bespaced away from the light-emitting layer 152 of the adjacentlight-emitting structure 150. A side surface of the light-emittingstructure 150 may be disposed on the bank insulating layer 160.

The light-emitting layer 152 may include an emitting material layer(EML) having an emission material. The emission material is an organicmaterial. The light-emitting layer 152 may have a multi-layer structurein order to increase luminous efficacy. For example, the light-emittinglayer 152 may further include at least one of a hole injection layer(HIL), a hole transport layer (HTL), an election transport layer (ETL)and an electron injection layer (EIL).

The upper light-emitting electrode 153 may include a conductivematerial. The upper light-emitting electrode 153 may include a materialdifferent from the lower light-emitting electrode 151. For example, theupper light-emitting electrode 153 may include a metal such as aluminum(Al). The reflectance of the upper light-emitting electrode 153 may behigher than the reflectance of the lower light-emitting electrode 151.

In the organic light-emitting display device according to an aspect ofthe present disclosure, the upper light-emitting electrode 153 of eachlight-emitting structure 150 may be connected to each other. Forexample, in the organic light-emitting display device according to anaspect of the present disclosure, the upper light-emitting electrode 153may extend onto the bank insulating layer 160. A side surface of thelight-emitting layer 152 of each light-emitting structure 150 may be indirect contact with the upper light-emitting electrode 153.

The organic light-emitting display device according to an aspect of thepresent disclosure may include an upper passivation layer 170 on thelight-emitting structure 150. The upper passivation layer 170 mayprevent damage from the light-emitting structure 150 due to moisture orparticles. For example, the upper passivation layer 170 may include aninorganic material.

The encapsulating layer 180 may be disposed between the upperpassivation layer 170 and the upper substrate 120. The encapsulatinglayer 180 may include an adhesive material. For example, the uppersubstrate 120 may be coupled to the lower substrate 110 in which thelight-emitting structure 150 is formed by the encapsulating layer 180.The upper substrate 120 may be in direct contact with the encapsulatinglayer 180. The light-emitting structure 150 may be surrounded by theencapsulating layer 180.

A size of the encapsulating layer 180 may be smaller than the size ofthe upper substrate 120. For example, the side surface of the uppersubstrate 120 may be disposed between the side surface of the lowersubstrate 110 and a side surface of the encapsulating layer 180. Theside inclined surface 121 sc and the corner inclined surface 120 cc ofthe upper substrate 120 may overlap with the lower substrate 110 in theoutside of the encapsulating layer 180. For example, the horizontaldistance d2 of the corner inclined surface 120 cc may be smaller than ahorizontal distance of the lower surface of the upper substrate 120exposed by the encapsulating layer 180.

The encapsulating layer 180 may have a multi-layer structure. Forexample, the encapsulating layer 180 may include a lower encapsulatinglayer 181 and an upper encapsulating layer 182.

The lower encapsulating layer 181 may be in direct contact with theupper passivation layer 170. The lower encapsulating layer 181 mayinclude a curable material. For example, the lower encapsulating layer181 may include a thermosetting resin.

The upper encapsulating layer 182 may be disposed between the lowerencapsulating layer 181 and the upper substrate 120. The upperencapsulating layer 182 may include a curable material. For example, theupper encapsulating layer 182 may include a thermosetting resin. Theupper encapsulating layer 182 may include a material different from thelower encapsulating layer 181.

The encapsulating layer 180 may block the moisture permeating from theoutside. For example, the upper encapsulating layer 182 may include amoisture-absorbing material 182 p.

The organic light-emitting display device according to an aspect of thepresent disclosure may include a data driver applying a data signal tothe display panel 100. The data driver may include source flexibleprinted circuit boards (source FPCBs) 210 and source drive ICs 220connected to the display panel 100 by the corresponding source FPCB 210.For example, each the source FPCB 210 may be connected to the sourceelectrode 135 of the thin film transistor 130 by the pad 105. Eachsource drive IC 220 may be mounted on the corresponding source FPCB 210.Each source drive IC 220 may generate the data signal by converting thedigital video data into gamma voltage. For example, the data driver mayfurther include a source printed circuit board 200 connected to thedisplay panel 100 through the source FPCBs 210.

The organic light-emitting display device according to an aspect presentdisclosure may include a gate driver applying a gate signal to thedisplay panel 100. The gate driver may include gate flexible printedcircuit boards (gat e FPCBs) 310 and gate drive ICs 320 connected to thedisplay panel 100 by the corresponding gate FPCB 310. For example, eachgate FPCB 310 may be connected to the gate electrode 133 of the thinfilm transistor 130 by the pad 105. The gate drive ICs 320 may bemounted on the corresponding gate FPCB 310. The gate drive ICs 320 mayinclude a level shifter and a shift resister, respectively.

The source FPCBs 210 and the gate FPCBs 310 may extend onto the uppersurface of the upper substrate 120. For example, the source drive ICs220 and the gate drive ICs 320 may be disposed on the upper surface ofthe upper substrate 120. The source printed circuit board 200 may belocated on the upper surface of the upper substrate 120.

The source FPCBs 210 and the gate FPCBs 310 may extend along the sideinclined surface 121 sc of the upper substrate 120. The side inclinedsurface 121 sc of the upper substrate 120 may be partially covered bythe source FPCBs 210 and the gate FPCBs 310. For example, the gate FPCBs310 may include a first FPCB insulating layer 311, a FPCB conductivelayer 312 and a second FPCB insulating layer 313, respectively. The FPCBconductive layer 312 may be a line for applying the gate signal to thedisplay panel 100 from the corresponding gate drive IC 320. The sourceFPCBs 210 may have a structure similar to the gate FPCBs 310.

The first FPCB insulating layer 311 may be disposed close to the uppersubstrate 120. The side inclined surface 121 sc of the upper substrate120 may be in direct contact with the first FPCB insulating layer 311. Athickness of the first FPCB insulating layer 311 may be larger than aheight of the concavo-convex shape of the side inclined surface 121 sc.Thus, in the organic light-emitting display device according to anaspect of the present disclosure, it may be possible to prevent the FPCBconductive layers 312 of the FPCBs 210 and the gate FPCBs 310 from beingdamaged by the concavo-convex shape of the side inclined surface 121 scof the upper substrate 120. Therefore, in the organic light-emittingdisplay device according to an aspect of the present disclosure, it maybe possible to prevent the distortion and/or the interruption of thesignal due to the upper substrate 120 including the side inclinedsurface 121 sc of the concavo-convex shape.

The first FPCB insulating layer 311 and the second FPCB insulating layer313 may prevent to the FPCB conductive layer 312 due to the externalimpact. The second FPCB insulating layer 313 may be disposed on an outersurface of the FPCB conductive layer 312. For example, the second FPCBinsulating layer 313 may be thicker than the first FPCB insulating layer311. The thickness of the first FPCB insulating layer 311 may be a valuebetween a thickness of the FPCB conductive layer 312 and a thickness ofthe second FPCB insulating layer 313. Thus, in the organiclight-emitting display device according to an aspect of the presentdisclosure, it may be possible to efficiently prevent the FPCBconductive layer 312 from being damaged by the concavo-convex shape ofthe side inclined surface 121 sc of the upper substrate 120 and theexternal impact.

The organic light-emitting display device according to an aspect of thepresent disclosure is described that the concavo-convex shape of theinclined surface 120 cc and 121 sc of the upper substrate 120 extends ina direction parallel with the side surface of the upper substrate 120,as shown in FIG. 2D. However, in the organic light-emitting displaydevice according to another aspect of the present disclosure, theconcavo-convex shape of the inclined surface 120 cc and 121 sc of theupper substrate 120 may be not parallel with the side surface of theupper substrate 120. For example, in the organic light-emitting displaydevice according to another aspect of the present disclosure, theinclined surface 120 cc and 121 sc of the upper substrate 120 mayinclude a concavo-convex shape extending in a direction vertical to theside surface of the upper substrate 120, as shown in FIG. 4.

FIGS. 5A to 5D are views sequentially showing a method of fabricatingthe organic light-emitting display device according to an aspect of thepresent disclosure. Referring to FIGS. 1, 2A to 2D, 3 and 5A to 5D, themethod of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure is described. First,the method of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure may include forming anupper mother substrate 120 m using a metal, forming an encapsulatinglayer 180 on a surface of the upper mother substrate 120 m, and forminga linear insulating film 400 on the encapsulating layer 180, as shown inFIG. 5A.

The linear insulating film 400 can prevent the upper mother substrate120 m and the encapsulating layer 180 from being damaged during transferfor next process. For example, the linear insulating film 400 mayinclude an insulating material.

The method of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure may include forming anupper substrate 120 by cutting the upper mother substrate 120 m using alaser 500 m, as shown in FIG. 5B.

Forming the upper substrate 120 may include cutting the encapsulatinglayer 180 and the linear insulating film 400. A laser may be used forthe process of cutting the encapsulating layer 180 and the linearinsulating film 400. The laser used in the cutting process of theencapsulating layer 180 and the linear insulating film 400 may bedifferent from the laser 500 m used in the cutting process of the uppermother substrate 120 m. For example, the method of fabricating theorganic light-emitting display device according to an aspect of thepresent disclosure may include a process of sequentially irradiatingdifferent types of lasers from the outside of the linear film 400, sothat the linear insulating film 400, the encapsulating layer 180 and theupper mother substrate 120 m are sequentially cut.

Cutting the upper mother substrate 120 m may include melting a metal bythe laser 500 m. Thus, a metal burr 120 mb may be formed at an edge ofthe surface of the upper substrate 120. For example, the metal burr 120mb may be formed at the edge of the surface of the upper substrate 120opposite to the encapsulating layer 180.

The method of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure may include removingthe metal burr 120 mb of the upper substrate 120 using a polishing unit600, as shown in FIG. 5C.

The polishing unit 600 may include a polishing wheel 610 and a drivingaxis 620 for rotating the polishing wheel 610. For example, removing themetal burr 120 mb may include locating the upper substrate 120 such thatthe metal burr 120 mb faces the polishing wheel 610, rotating thepolishing wheel 610 using the driving axis 620, and forming an inclinedsurface 121 sc at the edge of the corresponding surface of the uppersubstrate 120 using the rotating polishing wheel 610. Thus, in themethod of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure, the metal burr 120 mblocated at the corresponding portion may be completely removed by singleprocess using the rotating polishing wheel 610. Therefore, in the methodof fabricating the organic light-emitting display device according to anaspect of the present disclosure, lowering the process efficiency anduniformity may be prevented.

Forming the inclined surface 121 sc may include locating the uppersubstrate 120 above the polishing wheel 610. For example, forming theinclined surface 121 sc may include disposing the upper substrate 120such that the surface of the upper substrate 120 opposite to theencapsulating layer 180 faces a bottom of a space for the polishingprocess. Thus, in the method of fabricating the organic light-emittingdisplay device according to an aspect of the present disclosure,scattered particles generated in a polishing process using the polishingwheel 610 may be naturally removed. Therefore, in the method offabricating the organic light-emitting display device according to anaspect of the present disclosure, the damage and the adhesive failuredue to the scattered particles generated in the polishing process may beprevented.

Forming the inclined surface 121 sc may include polishing the edge ofthe upper substrate 120 using a side surface of the polishing wheel 610.Thus, in the method of fabricating the organic light-emitting displaydevice according to an aspect of the present disclosure, it may bepossible to prevent the scattered particles generated in the polishingprocess from flow into the driving unit of the polishing unit 600. Thatis, the method of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure may prevent damage tothe polishing unit 600 due to the scattered particles and freely adjustthe inclination angle of the inclined surface 121 sc. Therefore, in themethod of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure, the removing processof the metal burr 120 mb using the polishing wheel 610 may beefficiently performed.

The polishing wheel 610 may be a shape for easily polishing thecorresponding region of the upper substrate 120. For example, the sidesurface of the polishing wheel 610 may include a concavo-convex shapehaving a concave region and a convex region repeated in a directionvertical to the side surface of the polishing wheel 610. Theconcavo-convex shape of the polishing wheel 610 may extend along theside surface of the polishing wheel 610. Thus, in the method offabricating the organic light-emitting display device according to anaspect of the present disclosure, the inclined surface 121 sc of theupper substrate 120 by the polishing wheel 610 may be formed in theconcavo-convex shape.

The method of fabricating the organic light-emitting display deviceaccording to an aspect of the present is described that theconcavo-convex shape of the inclined surface 121 sc of the uppersubstrate 120 may be equal to the shape of the region of the polishingwheel 610 used in the polishing process. However, in the method offabricating the organic light-emitting display device according toanother aspect of the present disclosure, the inclined surface 121 sc ofthe upper substrate 120 may have a concavo-convex shape different fromthe region of the polishing wheel 610 used in the polishing process. Forexample, the method of fabricating the organic light-emitting displaydevice according to another aspect of the present disclosure may includemoving the polishing wheel 610 in a direction of extending the drivingaxis 620 during the polishing process. Thus, in the method offabricating the organic light-emitting display device according to anaspect of the present disclosure, the lifetime of the polishing wheel610 may be increased.

The polishing wheel 610 may have a relatively low wear rate as comparedto the upper substrate 120. The rigidity of the polishing wheel 610 maybe higher than the rigidity of the upper substrate 120. For example, thepolishing wheel 610 may be formed of diamond. Thus, in the method offabricating the organic light-emitting display device according to anaspect of the present disclosure, the inclined surface 121 sc of theupper substrate 120 may be uniformly formed by the polishing wheel 610.Therefore, in the method of fabricating the organic light-emittingdisplay device according to an aspect of the present disclosure, theprocess efficiency and the uniformity may be improved.

In the method of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure, the polishing wheel610 or the upper substrate 120 may be rotated. Thus, in the method offabricating the organic light-emitting display device according to anaspect of the present disclosure, the inclined surface 121 sc may becontinuously formed on four side surfaces of the upper substrate 120.For example, in the method of fabricating the organic light-emittingdisplay device according to an aspect of the present disclosure, acorner inclined surface 120 cc formed at a corner of the upper substrate120 may be longer than a side inclined surface 121 sc located between afront surface and a side surface of the upper substrate 120, as shown inFIGS. 2A and 3. Therefore, in the method of fabricating the organiclight-emitting display device according to an aspect of the presentdisclosure, the process time for removing the metal burr 120 mb can bereduced.

The method of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure may include cleaningthe upper substrate 120 in which the inclined surface 121 sc is formed,as shown in FIG. 5D.

Cleaning the upper substrate 120 may include moving particles on thesurface of the upper substrate 120 to the outside of the upper substrate120 using a brush 700. Thus, in the method of fabricating the organiclight-emitting display device according to an aspect of the presentdisclosure, coupling failure between the lower substrate 110 and theupper substrate 120 due to the particles can be prevented.

The method of fabricating the organic light-emitting display deviceaccording to an aspect of the present disclosure may include couplingthe upper substrate 120 in which the inclined surface 121 sc to a lowersubstrate 110 in which a light-emitting structure 150 is formed, andextending flexible printed circuit board 310 connected to a pad 105 ofthe lower substrate 110 onto an upper surface of the upper substrate 120opposite to the encapsulating layer 180, as shown in FIGS. 2A to 2D.

Coupling the upper substrate 120 to the lower substrate 110 may includecovering the light-emitting structure 150 using the encapsulating layer180. For example, coupling the upper substrate 120 to the lowersubstrate 110 may include locating the upper substrate 120 on the lowersubstrate 110 such that the encapsulating layer 180 faces thelight-emitting structure 150. Thus, in the method of fabricating theorganic light-emitting display device according to an aspect of thepresent disclosure, when the upper substrate 120 is coupled to the lowersubstrate 110, the inclined surface 121 sc may be disposed between anupper surface of the upper substrate 120 opposite to the encapsulatinglayer 180, and the side surface of the upper substrate 120.

Accordingly, in the organic light-emitting display device according toan aspect of the present disclosure and the method of fabricating thesame, the inclined surface 120 cc and 121 sc may be formed at the edgeof the upper substrate 120 on which the metal burr 120 mb is formed byusing the polishing wheel 610 rotated by the driving unit, so that themetal burr 120 mb may be completely removed by the single process. Thus,in the organic light-emitting display device according to an aspect ofthe present disclosure and the method of fabricating the same, theprocess efficiency and the uniformity may be prevented from beinglowered due to the removing process of the metal burr 120 mb. Therefore,in the organic light-emitting display device according to an aspect ofthe present disclosure and the method of fabricating the same, thereliability may be prevented from being decreased by the metal burrwithout lowering the process efficiency and uniformity.

Also, in the organic light-emitting display device according to anaspect of the present disclosure and the method of fabricating the same,the first FPCB 311 of FPCBs 210 and 310 being in direct contact with theinclined surface 120 cc and 121 sc of the upper substrate 120 may bethicker than a height of the concavo-convex shape of the inclinedsurface 120 cc and 121 sc, so that it may be possible to prevent theFPCB conductive layer 312 of the FPCBs 210 and 310 from being damaged bythe concavo-convex shape of the inclined surface 120 cc and 121 sc. Thatis, in the organic light-emitting display device according to an aspectof the present disclosure and the method of fabricating the same, it ispossible to prevent the FPCB 210 and 310 from being damaged by theremoving process of the metal burr 120 mb using the rotating polishingwheel 610. Therefore, in the organic light-emitting display deviceaccording to an aspect of the present disclosure and the method offabricating the same, the reliability may be further increased.

As a result, the organic light-emitting display device according to anaspect of the present disclosure and the method of fabricating the samemay include an upper substrate having an inclined surface at an edge ofa surface of the upper substrate opposite to an encapsulating layerwhich is polished by the rotating polishing wheel. Thus, in the organiclight-emitting display device according to an aspect of the presentdisclosure and the method of fabricating the same, the metal burr may becompletely removed by the single process. Thereby, in the organiclight-emitting display device according to an aspect of the presentdisclosure and the method of fabricating the same, the reliability maybe prevented from being decreased by the metal burr without lowering theprocess efficiency and uniformity.

What is claimed is:
 1. An organic light-emitting display devicecomprising: an upper substrate and a lower substrate facing each other,the upper substrate including a metal; and an encapsulating layerbetween the upper substrate and the lower substrate, wherein the uppersubstrate includes an upper surface opposite to the encapsulating layerand a side inclined surface having a concavo-convex shape, and the sideinclined surface is disposed between the upper surface and a sidesurface of the upper substrate, and wherein the upper substrate furtherincludes a corner inclined surface disposed at a corner of the uppersurface, and wherein the corner inclined surface has a length greaterthan that of the side inclined surface.
 2. The organic light-emittingdisplay device according to claim 1, wherein the side inclined surfaceof the upper substrate overlaps the lower substrate in an area outsidethe encapsulating layer.
 3. The organic light-emitting display deviceaccording to claim 1, wherein the concavo-convex shape of the sideinclined surface is extended to one direction.
 4. The organiclight-emitting display device according to claim 3, wherein theconcavo-convex shape of the side inclined surface is extended along theside surface of the upper substrate.
 5. The organic light-emittingdisplay device according to claim 1, further comprising a flexibleprinted circuit board connected to a pad disposed on the lower substrateoutside the encapsulating layer, the flexible printed circuit boardextending on the upper surface of the upper substrate.
 6. The organiclight-emitting display device according to claim 5, wherein the flexibleprinted circuit board includes a first FPCB insulating layer, a FPCBconductive layer and a second FPCB insulating layer, which aresequentially stacked.
 7. The organic light-emitting display deviceaccording to claim 6, wherein the first FPCB insulating layer in closeproximity to the upper substrate has a thickness greater than a heightof the concavo-convex shape of the side inclined surface.
 8. The organiclight-emitting display device according to claim 7, wherein the firstFPCB insulating layer is in contact with the side inclined surface ofthe upper substrate.
 9. The organic light-emitting display deviceaccording to claim 6, wherein the second FPCB insulating layer has athickness greater than the first FPCB insulating layer.
 10. The organiclight-emitting display device according to claim 1, wherein the cornerinclined surface of the upper substrate overlaps the lower substrate inan area outside the encapsulating layer.
 11. The organic light-emittingdisplay device according to claim 1, wherein a vertical distance betweena lower surface of the upper substrate facing the lower substrate andthe corner inclined surface is equal to a vertical distance between thelower surface of the upper substrate and the side inclined surface. 12.The organic light-emitting display device according to claim 11, whereinthe corner inclined surface has a height equal to that of the sideinclined surface.